教育经历

2019.08-2023.10克拉克森大学博士学位导师：Prof. Ming-cheng Cheng, Prof. Yu Liu

2016.09-2019.06中国科学技术大学硕士学位导师：刘志权研究员

2012.08-2016.06武汉大学学士学位

工作经历

2024.03-2025.02香港科技大学博士后/助理研究员合作导师：张薇教授

2025.02-至今  东北大学信息科学与工程学院副教授

研究方向

高性能多核芯片的热管理；芯片EDA设计；3D异构集成芯片性能和可靠性协同优化；开发应用于植入式医疗电子设备的低功耗电路；利用降阶模型、有限元方法、物理驱动神经网络模型的多物理场耦合的模拟计算。

招收博士/硕士方向

招收专业：集成电路，微电子，计算机体系架构等方向。

招生条件：对上述方向感兴趣，数学和代码能力强，有主动探索、勇于突破知识边界的热情和毅力。

特别提醒：本课题组与克拉克森大学、香港科技大学、武汉大学等国内外院校长期保持紧密合作，优秀学生有机会前往合作院校联合培养。

欢迎有兴趣的同学邮件联系，邮件标题请注明“硕/博士申请+毕业学校+姓名”，并附上个人简历。老师会回复每一份邮件，若一周内未收到回复，邮件可能被当作垃圾邮件，请再次发邮件提醒。

科研项目

1.深港澳科技计划A类项目，Research on the Technology for Integration andOptimization of Chiplet Architecture，278.745万港币；

2.美国NSF项目，ECCS-2003307，An Effective Thermal Simulation Methodology for GPGPUs Enabled by Data-Driven Model Reduction，约270万元；

3.美国NSF项目，CSE-2118079，High Performance Computing with Engineering Application，约239万元；

4.国家重点研发计划项目-子课题，2017YFB0305500，拘束条件下异质金属高可靠大面积焊接组织演变机理及技术，100万元。

学术成果

期刊论文

1．Lin Jiang, Anthony Dowling, et al.,“PODTherm-GP: A Physics-based Data-Driven Approach for Effective Architecture-Level Thermal Simulation of Multi-Core CPUs”IEEE Transaction on Computers, Vol. 72, no. 10, (2023): 2951-2962. (CCF-A).

2．Lin Jiang, Yu Liu, et al., “Full-Chip Dynamic Thermal Simulation with High Accuracy and Fine Resolution based on Model Order Reduction” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Vol. 42, no. 8, (2023): 2675-2688. (CCF-A).

3．Lin Jiang, Anthony Dowling, et al., “Ensemble Learning Model for Effective Thermal Simulation of Multi-core CPUs” Integration, the VLSI journal, Vol. 97 (2024): 102201.(CCF-C).

4．Lin Jiang, Liang Zhang, et al., “Effects of Al Interlayer and Ni (V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly.” Acta Metall Sin, Vol. 56, no. 10 (2020): 1433-1440.

5．Lin Jiang, Liang Zhang, et al., “Optimal design of Co/In/Cu sputtering target assembly using finite element method and taguchi method.” Acta Metallurgica Sinica (English Letters), Vol. 32, no. 11 (2019): 1407-1414.

6．Anthony Dowling, Lin Jiang, et al., “Regulating CPU Temperature with Thermal-Aware Scheduling Using a Reduced Order Learning Thermal Model.”Future Generation Computer Systems,(2024):107687.

7．Anthony Dowling, Lin Jiang, et al, “TDF: A compact file format plugin for FEniCS.” SoftwareX, Vol. 22, (2023): 101329.

8．Pulimeno Alessandro, Graham Coates-Farley, Martin Veresko, Lin Jiang, Ming-Cheng Cheng, Yu Liu, and Daqing Hou*, Physics-driven proper orthogonal decomposition: A simulation methodology for partial differential equations. MethodsX, Vol. 10, (2023): 102204

会议论文

1.Lin Jiang, Yu Liu, et al., “Predicting Accurate Hot Spots in a More Than Ten-Thousand-Core GPU with a Million-Time Speedup over FEM Enabled by a Physics-based Learning Algorithm.” In 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm). pp. 1-7, IEEE, 2024.

2.Lin Jiang, Martin Veresko, et al., “An Effective Physics Simulation Methodology Based on a Data-Driven Learning Algorithm” In Proceedings of the Platform for Advanced Scientific Computing Conference (PASC), pp. 1-10. ACM, 2022.

3.Lin Jiang, Dowling, Anthony, et al., “Exploring an Efficient Approach for Architecture-Level Thermal Simulation of Multi-core CPUs” In 2022 IEEE International Symposium on Circuits and Systems (ISCAS), pp. 278-282. IEEE, 2022.

4.Lin Jiang, Dowling, Anthony, et al, “Chip-level Thermal Simulation for a Multicore Processor Using a Multi-Block Model Enabled by Proper Orthogonal Decomposition” In 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) pp. 1-7. IEEE, 2022. (Best Paper Award).

5.Lin Jiang, Yu Liu, and Ming-C. Cheng*, An Effective and Accurate Data-Driven Approach for Thermal Simulation of CPUs. In 2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm), pp. 1008-1014. IEEE, 2021.

专利

1 刘志权姜霖陈胤伯刘畅. 一种三明治结构Co靶材背板扩散焊组件中间层的选取方法[P]. CN201910687276.4.

2 刘兴海冯程琛许琦炀姜霖陈楚雄陈政杰韩晓雪黎厚斌. 一种主动调控角度的Kirigami结构VO2智能窗及其搭设方法和应用[P]. CN202310766311.

获奖

2022年IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems会议最佳论文奖。

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